Yu, Xinguang
Fu, Zhi
Morisako, Isamu
Koshiba, Keiko
Iizuka, Tomonori
Tatsumi, Kohei
Funding for this research was provided by:
JST SPRING (JPMJSP2128)
Article Title: Improvement in the reliability of crystalline silicon solar cell interconnection by using Nickel Micro-Plating Bonding (NMPB) technology
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2022 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2022-05-23
Date Accepted: 2022-11-14
Online publication date: 2022-12-05