Feng, Wei
Kikuchi, Katsuya
Article Title: Heat transfer study of 3D packaging structure with superconducting TSV for practical-scale quantum annealing machines
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2024 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2023-05-18
Date Accepted: 2024-04-11
Online publication date: 2024-05-17