Jeong, Byeong Hwa
Kim, Dong Woo
Lee, Sun Young
Kim, Dong Shin
Lee, Seung Han
Lee, Sang Ho
Uematsu, Masaki
Kokaze, Yutaka
Taura, Yasuyuki
Harada, Masamichi
Yeom, Geun Young
Kim, Kyong Nam
Funding for this research was provided by:
ULVAC, Inc.
Sungkyunkwan University Leaders in Industry-University Coopera-tion+
Article Title: Enhancing Cu interconnect reflow in back-end-of-line metal wiring with ultrathin Co liners
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2025 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2024-08-14
Date Accepted: 2024-12-18
Online publication date: 2025-01-20