Abadie, K. https://orcid.org/0000-0003-3778-3064
Renaud, P.
Fournel, F.
Michaud, L. G.
Danner, M.
Dornetshumer, M.
Lecouvey, C.
Papon, A.-M.
Chevalier, I.
Monniez, T.
Matei, C.
David, T.
Dominguez, S.
Dubarry, C.
Article Title: Surface activated Cu/SiO2 hybrid bonding for room temperature 3D integration
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2025 The Author(s). Published on behalf of The Japan Society of Applied Physics by IOP Publishing Ltd
Publication dates
Date Received: 2025-01-02
Date Accepted: 2025-02-13
Online publication date: 2025-03-05