Song, Kyeong-Youn
Na, Seungjun
Choi, Hoon
Lee, Hoo-Jeong
Funding for this research was provided by:
Samsung (IO201214-08167-01)
Article Title: Improvement of thermal stability of NiAl via employing Al capping layer for advanced interconnect applications
Journal Title: Applied Physics Express
Article Type: paper
Copyright Information: © 2023 The Japan Society of Applied Physics
Publication dates
Date Received: 2022-12-21
Date Accepted: 2023-02-23
Online publication date: 2023-03-10