Shangguan, Lianchao
Wang, Zhenyu
Chen, Ziqiang
Fan, Siyu
Li, Chuannan
Zhang, Jian
Wang, Muwei
Funding for this research was provided by:
National Natural Science Foundation of China (Grant No. 61675088)
International Science & Technology Cooperation Program of Jilin (Grant No. 20190701023GH)
Scientific and Technological Developing Scheme of Jilin Province (Grants No. 20200401045GX)
Project of Science and Technology Development Plan of Jilin Province (Grant No. 20190302011G)
Article Title: Modulating residual stress based on atomic layer deposition to enhance the adhesion of parylene C for encapsulation of flexible organic light-emitting diodes
Journal Title: Applied Physics Express
Article Type: paper
Copyright Information: © 2023 The Japan Society of Applied Physics
Publication dates
Date Received: 2023-02-24
Date Accepted: 2023-03-23
Online publication date: 2023-04-14