Miyajima, Hideshi
Watanabe, Kei
Ishikawa, Kenji
Sekine, Makoto
Hori, Masaru
Article Title: Adhesion enhancement and amine reduction using film redeposited at the interface of a stack of plasma-enhanced CVD dielectrics for Cu/low- k interconnects
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2019 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2018-11-14
Date Accepted: 2018-12-27
Online publication date: 2019-01-23