Gomasang, Ploybussara
Ogiue, Satoru
Yokogawa, Shinji
Ueno, Kazuyoshi
Funding for this research was provided by:
Core Research for Evolutional Science and Technology (JPMJCR1532)
Japan Society for the Promotion of Science (JP17H06293, JP15H01786)
Journal title: Japanese Journal of Applied Physics
Article type: paper
Article title: Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations
Copyright information: © 2019 The Japan Society of Applied Physics
Publication dates
Date received: 2018-10-01
Date accepted: 2019-01-05
Online publication date: 2019-02-22