Fujino, Masahisa https://orcid.org/0000-0001-5281-846X
Takahashi, Kenji
Araga, Yuuki
Kikuchi, Katsuya
Article Title: 300 mm wafer-level hybrid bonding for Cu/interlayer dielectric bonding in vacuum
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2019 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2019-08-07
Date Accepted: 2019-10-04
Online publication date: 2019-11-26