Fujino, Masahisa https://orcid.org/0000-0001-5281-846X
Takahashi, Kenji
Araga, Yuuki
Kikuchi, Katsuya
Journal title: Japanese Journal of Applied Physics
Article type: paper
Article title: 300 mm wafer-level hybrid bonding for Cu/interlayer dielectric bonding in vacuum
Copyright information: © 2019 The Japan Society of Applied Physics
Publication dates
Date received: 2019-08-07
Date accepted: 2019-10-04
Online publication date: 2019-11-26