Shie, Kai Cheng
Juang, Jing-Ye
Chen, Chih
Article Title: Instant Cu-to-Cu direct bonding enabled by 〈111〉-oriented nanotwinned Cu bumps
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2019 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2019-07-31
Date Accepted: 2019-11-12
Online publication date: 2019-12-09