Jeong, Minsu
Bae, Byung-Hyun
Lee, Hyeonchul
Kang, Hee-Oh
Hwang, Wook-Jung
Yang, Jun-Mo
Park, Young-Bae
Article Title: Effects of post-annealing and temperature/humidity treatments on the interfacial adhesion energy of the Cu/SiNx interface for Cu interconnects
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2016 The Japan Society of Applied Physics
Publication dates
Date Received: 2015-11-04
Date Accepted: 2015-12-08
Online publication date: 2016-05-09