Gu, Xun
Deng, Hao
Tong, Zheyuan
Jing, Xuezhen
Journal title: Japanese Journal of Applied Physics
Article type: note
Article title: Film deposition and UV curing process impact on ultralow-kdielectric for high performance Cu interconnects
Copyright information: © 2017 The Japan Society of Applied Physics
Publication dates
Date received: 2016-12-02
Date accepted: 2017-03-07
Online publication date: 2017-06-20