Park, Janghoon
Lee, Jongsu
Sung, Ki-Hak
Shin, Kee-Hyun
Kang, Hyunkyoo
Funding for this research was provided by:
Alexander von Humboldt-Stiftung (KOR1147897STP)
National Research Foundation of Korea (2014K1A3A1A24068732)
Ministry of Trade, Industry and Energy (10042537)
Journal title: Japanese Journal of Applied Physics
Article type: lett
Article title: Quantitative analysis of peel-off degree for printed electronics
Copyright information: © 2018 The Japan Society of Applied Physics
Publication dates
Date received: 2017-09-24
Date accepted: 2017-11-11
Online publication date: 2017-12-28