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Heterogeneous integration based on low-temperature bonding for advanced optoelectronic devices

Published Online: 2018-03-05

Published Print: 2018-04-01

Authors

Higurashi, Eiji
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Text and Data Mining valid from 2018-03-05

Version of Record valid from 2018-03-05
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Journal title: Japanese Journal of Applied Physics

Article type: rev

Article title: Heterogeneous integration based on low-temperature bonding for advanced optoelectronic devices

Copyright information: © 2018 The Japan Society of Applied Physics

Publication dates

Date received: 2017-10-10

Date accepted: 2017-12-04

Online publication date: 2018-03-05

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