Three Dimensional Simulation of Filling Process for Stacked-Chip Scale Packages
Crossref DOI link: https://doi.org/10.1007/978-3-030-05621-6_1
Published Online: 2019-01-15
Published Print: 2019
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mior Abd Majid, Mior Firdaus
Mohamad Sidik, Mohamad Sabri
Abu Bakar, Muhamad Husaini
Shafee, Khairul Shahril
Yusuf, Zainal Nazri Mohd
Zain, Mohamad Shukri Mohd
Zulkifly Abdullah, Mohd.
Text and Data Mining valid from 2019-01-01
Chapter History
First Online: 15 January 2019