Enhanced Forced Convection Cooling of Power Electronics Devices Exposed to Hot Climatıc Conditions by Copper Metal Foam
Crossref DOI link: https://doi.org/10.1007/978-3-030-16962-6_78
Published Online: 2019-11-07
Published Print: 2020
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Borakhade, Kishor
Mahalle, Ashish
Text and Data Mining valid from 2019-11-07
Chapter History
First Online: 7 November 2019