Bonding and High-Temperature Storage Performance of Die Attachment with Ag Paste Sintering on Bare Direct Bonding Aluminum (DBA) Substrate
Crossref DOI link: https://doi.org/10.1007/978-3-030-36296-6_65
Published Online: 2020-02-12
Published Print: 2020
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Zheng
Chen, Chuangtong
Kim, Dongjin
Suetake, Aiji
Nagao, Shijo
Suganuma, Katsuaki
Text and Data Mining valid from 2020-01-01
Chapter History
First Online: 12 February 2020