Resistive Random Access Memory (RRAM) Technology: From Material, Device, Selector, 3D Integration to Bottom-Up Fabrication
Crossref DOI link: https://doi.org/10.1007/978-3-030-42424-4_3
Published Online: 2021-10-16
Published Print: 2022
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Hong-Yu
Brivio, Stefano
Chang, Che-Chia
Frascaroli, Jacopo
Hou, Tuo-Hung
Hudec, Boris
Liu, Ming
Lv, Hangbing
Molas, Gabriel
Sohn, Joon
Spiga, Sabina
Teja, V. Mani
Vianello, Elisa
Wong, H.-S. Philip
Text and Data Mining valid from 2021-10-16
Version of Record valid from 2021-10-16
Chapter History
First Online: 16 October 2021