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Simulation of Intergranular Void Growth Under the Combined Effects of Surface Diffusion, Grain Boundary Diffusion, and Bulk Creep

Crossref DOI link: https://doi.org/10.1007/978-3-030-65261-6_76

Published Online: 2021-02-24

Published Print: 2021

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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