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Mechanism Behind Al/Cu Interface Reaction: The Kinetics and Diffusion of Cu in Forming Different Intermetallic Compounds

Crossref DOI link: https://doi.org/10.1007/978-3-030-65396-5_15

Published Online: 2021-02-24

Published Print: 2021

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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