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Temperature- and Strain Rate-Dependent Damage Mechanics of Solder/IMC Interface Fracture in a Ball Grid Array Assembly

Crossref DOI link: https://doi.org/10.1007/978-3-031-01488-8_9

Published Online: 2022-06-01

Published Print: 2022

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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