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Authors
Wang, Pin-Wen https://orcid.org/0009-0009-8779-1258
Tseng, Yi-Chi https://orcid.org/0009-0008-1651-1776
Lin, Chung-Wei https://orcid.org/0000-0001-8309-7028
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More Information
Chapter History
First Online: 5 February 2024
Conference Information
Conference Acronym: SmartSP
Conference Name: International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles
Conference City: Chicago, IL
Conference Country: USA
Conference Year: 2023
Conference Start Date: 12 October 2023
Conference End Date: 16 October 2023
Conference ID: smartsp2023
Conference URL: https://smartsp.eai-conferences.org/2023/
Peer Review Information (provided by the conference organizers)
Type: Double-blind
Conference Management System: Confy +
Number of Submissions Sent for Review: 24
Number of Full Papers Accepted: 11
Number of Short Papers Accepted: 0
Acceptance Rate of Full Papers: 46% - The value is computed by the equation "Number of Full Papers Accepted / Number of Submissions Sent for Review * 100" and then rounded to a whole number.
Average Number of Reviews per Paper: 2,67
Average Number of Papers per Reviewer: 2,22
External Reviewers Involved: No
