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Health Monitoring Fatigue Properties of Solder Interconnects in LED Drivers

Crossref DOI link: https://doi.org/10.1007/978-3-031-59361-1_13

Published Online: 2024-07-13

Published Print: 2024

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Du, L.

Zhao, X.

Poelma, R. H. https://orcid.org/0000-0002-4180-7033
van Driel, W. D. https://orcid.org/0000-0001-8882-2508
Zhang, G. Q. https://orcid.org/0000-0002-8023-5170
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Text and Data Mining valid from 2024-01-01

Version of Record valid from 2024-01-01
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Chapter History

First Online: 13 July 2024