High-voltage SiC Power Module Packaging
Crossref DOI link: https://doi.org/10.1007/978-3-031-80252-2_5
Published Online: 2025-03-25
Published Print: 2025
Update policy: https://doi.org/10.1007/springer_crossmark_policy
DiMarino, Christina
Lu, Guo-Quan
Zhan, Cao
Leslie, Scott G.
Text and Data Mining valid from 2025-01-01
Version of Record valid from 2025-01-01
Chapter History
First Online: 25 March 2025