Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging
Crossref DOI link: https://doi.org/10.1007/978-3-319-90362-0_28
Published Online: 2018-09-23
Published Print: 2018
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ma, Lunyu
Sitaraman, Suresh K.
Zhu, Qi
Klein, Kevin
Fork, David
Text and Data Mining valid from 2018-01-01