Design of Novel Through Silicon via Structures for Reduced Crosstalk Effects in 3D IC Applications
Crossref DOI link: https://doi.org/10.1007/978-981-10-5903-2_61
Published Online: 2018-04-11
Published Print: 2018
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ganimidi, Mounika
Ramesh Kumar, Vobulapuram
License valid from 2018-01-01