Microstructure, Residual Stress and Corrosion Resistance in Electrodeposited Copper Foils
Crossref DOI link: https://doi.org/10.1007/978-981-13-0107-0_32
Published Online: 2018-04-18
Published Print: 2018
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hua, Yanhong
Nie, Zhihua
Huang, Guojie
Li, Yanfeng
Xie, Haofeng
Liu, Dongmei
License valid from 2018-01-01