Influence of Process Parameters by Enclosed Cooling Slope Channel on Microstructures of Semi-solid ZCuSn10P1 Alloy
Crossref DOI link: https://doi.org/10.1007/978-981-13-0107-0_55
Published Online: 2018-04-18
Published Print: 2018
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Yongkun
Zhou, Rongfeng
Li, Lu
Xiao, Fan
Jiang, Yehua
Lu, Dehong
License valid from 2018-01-01