Investigation on the Thermal Conductivity of Shanghai Soft Clay
Crossref DOI link: https://doi.org/10.1007/978-981-13-0125-4_109
Published Online: 2018-05-08
Published Print: 2018
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Bao
Huang, Yiyi
Ye, Weimin
Cui, Yujun
Xu, Zou
License valid from 2018-01-01