Printed Circuit Board Modelling for Thermal Analysis of Electronics Packages
Crossref DOI link: https://doi.org/10.1007/978-981-13-1966-2_25
Published Online: 2018-09-29
Published Print: 2019
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mahitkar, Jayesh
Chauhan, Mayank
Gediya, Hardik
Singh, Vivek K.
Text and Data Mining valid from 2018-09-29