Innovative Nitride Film Deposition on Copper Interconnects of MEMS Devices Using Plasma-Enhanced Chemical Vapor Deposition Techniques
Crossref DOI link: https://doi.org/10.1007/978-981-13-6374-0_13
Published Online: 2019-04-18
Published Print: 2019
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jagadeesha, T.
Kim, Louis
Text and Data Mining valid from 2019-01-01
Chapter History
First Online: 18 April 2019