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Steady-State and Transient Simulations of Heat Dissipation from an Electronic Component Kept in a Closed Enclosure Using OpenFOAM

Crossref DOI link: https://doi.org/10.1007/978-981-15-1892-8_39

Published Online: 2020-02-19

Published Print: 2020

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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