Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design
Crossref DOI link: https://doi.org/10.1007/978-981-15-7090-2_13
Published Online: 2020-11-24
Published Print: 2021
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kandlikar, Satish G.
Ganguly, Amlan
Text and Data Mining valid from 2020-11-24
Version of Record valid from 2020-11-24
Chapter History
First Online: 24 November 2020