Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization
Crossref DOI link: https://doi.org/10.1007/978-981-15-7090-2_15
Published Online: 2020-11-24
Published Print: 2021
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Liangbiao
Jiang, Tengfei
Fan, Xuejun
Text and Data Mining valid from 2020-11-24
Version of Record valid from 2020-11-24
Chapter History
First Online: 24 November 2020