Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging
Crossref DOI link: https://doi.org/10.1007/978-981-15-7090-2_8
Published Online: 2020-11-24
Published Print: 2021
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suga, Tadatomo
He, Ran
Vakanas, George
La Manna, Antonio
Text and Data Mining valid from 2020-11-24
Version of Record valid from 2020-11-24
Chapter History
First Online: 24 November 2020