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Convective Flow of Nanofluid and Nanoencapsulated Phase Change Material Through Microchannel Heat Sink for Passive Cooling of Microelectronics

Crossref DOI link: https://doi.org/10.1007/978-981-15-7711-6_6

Published Online: 2021-01-11

Published Print: 2021

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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