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Repairing TSVs for 3D ICs Using Redundant TSV

Crossref DOI link: https://doi.org/10.1007/978-981-16-7011-4_13

Published Online: 2022-02-15

Published Print: 2022

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Ghosh, Sudeep https://orcid.org/0000-0003-1699-1390
Banik, Mandira

Chakraborty, Tridib

Mizan, Chowdhury Md.

Ghosh, Trishita

Basu, Soumyadipta
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Text and Data Mining valid from 2022-01-01

Version of Record valid from 2022-01-01
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Chapter History

First Online: 15 February 2022