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Computational Prediction of SiCf/SiC Stiffness and Thermal Residual Stress by 3D Micro-scale FEA Methods

Crossref DOI link: https://doi.org/10.1007/978-981-16-7423-5_18

Published Online: 2021-11-02

Published Print: 2022

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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