Thermohydraulic Characteristics of Microchannel Heat Sinks Used in Electronic Cooling Applications
Crossref DOI link: https://doi.org/10.1007/978-981-19-2188-9_66
Published Online: 2022-09-09
Published Print: 2023
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tiruveedula, Mohan Sukumar
Gadekula, Rajesh Kumar
Dondapati, Raja Sekhar
Text and Data Mining valid from 2022-09-09
Version of Record valid from 2022-09-09
Chapter History
First Online: 9 September 2022