Effective Cooling of Electronic Components Using Porous Filled Heat Exchangers
Crossref DOI link: https://doi.org/10.1007/978-981-19-3498-8_9
Published Online: 2022-11-05
Published Print: 2023
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Venkata Sai Satyanarayana Sastry, S.
Bhanu Prakash, S.
Text and Data Mining valid from 2022-11-05
Version of Record valid from 2022-11-05
Chapter History
First Online: 5 November 2022