Design, Fabrication and Measurement of Heat Sink with Microchannel Cold Frame for Electronics Cooling
Crossref DOI link: https://doi.org/10.1007/978-981-32-9441-7_44
Published Online: 2019-08-31
Published Print: 2020
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bian, Yanfei
Zhuang, Shuai
Cai, Meng
Li, Shi
Tong, Lichao
Wu, Shengxuan
Text and Data Mining valid from 2019-08-31
Chapter History
First Online: 31 August 2019