Microstructure and Properties of Semi-solid Die Casting of High Silicon Aluminum Alloy with High Thermal Conductivity
Crossref DOI link: https://doi.org/10.1007/978-981-32-9441-7_47
Published Online: 2019-08-31
Published Print: 2020
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Jin
Wu, Shusen
Zheng, Jinqiao
Text and Data Mining valid from 2019-08-31
Chapter History
First Online: 31 August 2019