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Solution Hardening Effect of Bi Additions to the β-In3Sn Phase in In-Sn-Bi Low Temperature Solder Alloys via Alloy Design and Heat Treatment

Crossref DOI link: https://doi.org/10.1007/978-981-96-2871-1_10

Published Online: 2025-03-12

Published Print: 2025

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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