Document is current

Any future updates will be listed below

3D Stacked IC Chip Design: From CMOS to 2D Materials

Crossref DOI link: https://doi.org/10.1007/978-981-99-6649-3_57

Published Online: 2024-02-29

Published Print: 2024

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark