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The effect of interfacial thermal resistance on interface crack subjected to remote heat flux

Published Online: 2019-12-21

Published Print: 2020-02

Authors

Wang, Jie

Dai, Ming https://orcid.org/0000-0001-5608-0247
Gao, Cun-Fa
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (11872203, 11902147)

Natural Science Foundation of Jiangsu Province (BK20190393)
License Information

Text and Data Mining valid from 2019-12-21

Version of Record valid from 2019-12-21
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Article History

Received: 10 November 2019

Revised: 10 December 2019

First Online: 21 December 2019

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