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Thermal Reliability Analysis for 7-nm FinFET Based Positive Edge Triggered TSPC Flip-Flop for Future IoT and AI Applications

Published Online: 2025-10-14

Authors

Juveria, Syeda Hurmath https://orcid.org/0009-0002-4433-9922
Ajayan, J.

Shashank, R.
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Text and Data Mining valid from 2025-10-14

Version of Record valid from 2025-10-14
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Article History

Received: 26 June 2025

Revised: 10 September 2025

Accepted: 11 September 2025

First Online: 14 October 2025

Declarations

:

: The authors declare that they have no conflicts of interest.

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