Determination of the percentage of wood failure by 3D scanning of the adhesive bondline
Crossref DOI link: https://doi.org/10.1007/s00107-014-0806-8
Published Online: 2014-05-01
Published Print: 2014-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kariz, Mirko
Sernek, Milan
Text and Data Mining valid from 2014-05-01