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TsanKit: artificial intelligence for solder ball head-in-pillow defect inspection

Crossref DOI link: https://doi.org/10.1007/s00138-021-01192-8

Published Online: 2021-03-24

Published Print: 2021-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Tsan, Ting-Chen

Shih, Teng-Fu https://orcid.org/0000-0003-4477-9805
Fuh, Chiou-Shann
License Information

Text and Data Mining valid from 2021-03-24

Version of Record valid from 2021-03-24
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Article History

Received: 21 August 2019

Revised: 6 August 2020

Accepted: 5 March 2021

First Online: 24 March 2021