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Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes

Crossref DOI link: https://doi.org/10.1007/s00170-014-5982-5

Published Online: 2014-05-29

Published Print: 2014-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy