A three-dimensional heat conduction inverse procedure to investigate tool–chip thermal interaction in machining process
Crossref DOI link: https://doi.org/10.1007/s00170-014-6119-6
Published Online: 2014-07-06
Published Print: 2014-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Norouzifard, Vahid
Hamedi, Mohsen
Text and Data Mining valid from 2014-07-06